TECNO Unveils the World’s Thinnest Modular Smartphone Ecosystem Concept
February 27, 2026– AI-driven innovative technology brand TECNO is set to unveil its groundbreaking Modular Magnetic Interconnection Technology at MWC 2026. This concept, embodied by TECNO Modular Phone, represents TECNO’s pioneering exploration of the next-generation form of smartphones, where hardware expansion is instantaneous through magnetic attachment and intelligent connectivity. Designed to bridge the gap between […]











